View BGB203_2725504.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

BGB203 bluetooth system-in-a-package radio with baseband controller rev. 1.0 ? 2005 july 28 product shortform datasheet 1. general description the BGB203 combines the bluetooth rf part, protocol stack, link controller (lc), link manager (lm), and host controller interface (hci) firmware of the bluetooth system specification in one sip with embedded software. together with an antenna and a reference clock this device forms a complete bluetooth solution. in most cases this sip will be attached to a host, for example a gsm baseband controller or a pc processor. the BGB203 is designed to be used for wireless links operating in the globally available ism band, between 2402 and 2480 mhz. the radio part is composed of a fully integrated, state-of-the-art near-zero-if transceiver chip, an antenna filter for out-of-band blocking, a tx/rx switch, tx and rx baluns, and a basic amount of supply decoupling. the device is a plug-and-play package that needs only 3 additional decoupling components next to an antenna and reference clock for proper operation. robust design allows for untrimmed components, giving a cost-optimized solution. demodulation is done in open-loop mode to reduce the effects of reference frequency breakthrough on reception quality. an advanced offset compensation circuit compensates for vco drift and rf frequency errors during open-loop demodulation, under control by the baseband processor. the circuit is integrated on a laminate substrate. it is connected to the main pcb through a hvqfn48 compatible footprint. the rf port has a normalized 50 w impedance and can be connected directly to an external antenna with a 50 w transmission line. a high-dynamic range rssi allows near-instantaneous assessment of radio link quality, and is used for output power-control purposes. the baseband part and the rf interface of the sip is designed to operate at 1.8v. the rf part of the sip is designed to operate from 2.75 v nominal supplies. separate ground connections are provided for reduced parasitic coupling between different stages of the circuit. there is a basic amount of rf supply decoupling incorporated into the circuit. the industry standard arm7tdmi microcontroller with low power consumption is integrated together with a flash memory and a sram. there are no provisions for external controllers to directly access on-chip data memory. communication with an external host, for example a pc, gsm or pda, is handled via the host controller interface. industry standard interfaces such as pcm, uart, usb, and i 2 c are supported by on-chip hardware. www. datasheet datasheet datasheet datasheet 4u 4u4u 4u .com
philips semiconductors BGB203 bluetooth radio module with baseband controller product shortform datasheet rev. 1.0 ? 2005 july 28 2 of 24 2. features 2.1 general plug-and-play bluetooth class 1 system-in-a-package (sip) includes all baseband and radio functionality, from hci up to antenna, needs only external antenna and reference clock. fully compliant to bluetooth radio specification version 1.2. small dimensions (7x8x1.3 mm typical) in hvqfn like package with full bgb204 hvqfn compatible footprint 2.2 radio hardware fully integrated near-zero-if receiver with high sensitivity (typical -88 dbm at antenna input) digital demodulator for improved reception quality rssi with high dynamic range programmable output pre-amplifier maximum output power up to +5.5 dbm typical includes high performance blocking filter for co-existence in gsm/dcs/wcdma applications fully integrated low phase noise vco operating in the 5 ghz frequency range 2.3 baseband hardware 2.3.1 hardware features bluetooth burst mode controller with ciphering, scrambling, crc checking/generation, fec encoding/decoding and data buffering control support for 7 slaves and three piconets, support of master-slave switch for new nodes entering the piconet, scatternet support with maximum one slave in master piconet while being slave in another piconet, support for 2 voice channels. bt1.2 features : fast connection, ev3 (hv3+crc), afh ip : afh switch support as master,channel assesment as master. embedded 32-bit microprocessor consisting of an arm7tdmi-s risc controller featuring low mw/mhz integrated flash memory : 268 kbytes. sram : 40 kbytes. voice processing with a cvsd, a-law or m-law. support of a direct link between pcm interface and bt1.2 core for the voice channels. power management providing power-on reset www. datasheet datasheet datasheet datasheet 4u 4u4u 4u .com
philips semiconductors BGB203 bluetooth radio module with baseband controller product shortform datasheet rev. 1.0 ? 2005 july 28 3 of 24 clocking low power clock crystal oscillator for low power mode, accepting 3.2khz, 32khz, and 32.768khz. low-power system clock crystal oscillator with programmable on-chip capacitors for frequency adjustment with large pulling range accepting the frequency 12mhz, 13mhz, 24mhz and 26 mhz. microprocessor interfaces general purpose i/o-pins i 2 c-bus interface multi port pcm interface (linear and log pcm up to 16 bit/sample supported) uart with hardware handshake and irda support usb interface (vddio2 : 3.3v). system timers watch dog timer jtag for ice and flash memory programming etm7 for real time trace. patch interface for rom version emulation. voltage range radio 2.75 v core 1.8 v peripheral pins 1.8 and 3.3 v operating ambient temperature range: -30 to +85 c 2.3.2 firmware features bluetooth burst mode controller driver link controller (lc) link manager (lm) host controller interface (hci) interface drivers voice processing. 3. applications cellphones, smartphones computing applications (pc, notebook, pda) cellular accessories (bluetooth headsets) www. datasheet datasheet datasheet datasheet 4u 4u4u 4u .com
philips semiconductors BGB203 bluetooth radio module with baseband controller product shortform datasheet rev. 1.0 ? 2005 july 28 4 of 24 4. pinning information 4.1 pinning 4.2 pin description fig 1. package outline and pinning for the BGB203; dimensions 7 x 8 mm (top view) gnd gnd gnd gnd gnd gnd gnd gnd gnd gpio[14] gpio[12] ant 1 13 25 37 gpio[15] dn_usb dp_usb gpio[1] gpio[0] vanlo gpio[11] gpio[13] gpio[10] vddc/vddio1 gpio[16] xtal2_sys xtal1_sys vbus_usb xtal2_lpo xtal1_lpo gpio[7] gpio[9] gpio[6] gpio[8] vddc vddio2 vddrf gpio[17] gpio[3] gpio[5] gpio[4] gpio[2] reset_n vddiorf tms_jtag tdo_jtag tck_jtag tdi_jtag BGB203 vdda/vddo vddio1 pin 49 table 1: pin description BGB203 pin nr. pin name i/o reset state supply domain description 1,3,4,5,6, 7,8,9,10,49 gnd ground 2 ant i/o antenna input / output 11 gpio[14] i/o i pull-up vddio1 general purpose i/o 14 12 gpio[12] i/o i pull-up vddio1 general purpose i/o 12 13 vddrf positive radio supply voltage 14 gpio[17] i/o i pull-up vddio1 general purpose i/o 17 15 vanlo i/o vdda analog voltage source input 16 gpio[1] / i2c_sda i/o i vddio1 general purpose i/o 1 i 2 c bus serial data 17 gpio[0] / i2c_scl i/o i vddio1 general purpose i/o 0 i 2 c bus serial clock 18 vdda / vddo positive analogue and oscillator supply voltage 19 xtal2_sys o vddo system clock crystal oscillator output 20 xtal1_sys i vddo system clock crystal oscillator input 21 gpio[13] i/o i pull-up vddio1 general purpose i/o 13 22 gpio[11] i/o i pull-up vddio1 general purpose i/o 11 www. datasheet datasheet datasheet datasheet 4u 4u4u 4u .com
philips semiconductors BGB203 bluetooth radio module with baseband controller product shortform datasheet rev. 1.0 ? 2005 july 28 5 of 24 23 gpio[10] / sys_clk_req i/o o high vddio1 general purpose i/o 10 external system clock request 24 vddc / vddio1 positive core and i/o1 supply voltage 25 gpio[16] / osc_mode i/o i pull-up vddio1 general purpose i/o 16 oscillator mode selection (gnd = slave mode) 26 vddc / vddio1 positive core and i/o1 supply voltage 27 xtal1_lpo i vddio1 low power clock crystal oscillator intput 28 xtal2_lpo o vddio1 low power clock crystal oscillator output 29 vbus_usb i i vddio2 usb vbus detect 30 gpio[15] sys_clk_req i/o o high vddio2 general purpose i/o 15 external system clock request 31 gpio[7] fsc_ip i/o i pull-up vddio2 general purpose i/o 7 pcm/iom frame sync 32 gpio[9] db_ip i/o i pull-up vddio2 general purpose i/o 9 bidirectional pcm/iom data line b (default: input) 33 gpio[6] da_ip i/o i pull-up vddio2 general purpose i/o 6 bidirectional pcm/iom data line a (default: output) 34 gpio[8] dclk_ip i/o i pull-up vddio2 general purpose i/o 8 pcm/iom data clock 35 vddc positive core supply voltage 36 vddio2 i/o2 supply voltage 37 dn_usb i/o i vddio2 usb data n 38 dp_usb i/o i vddio2 usb data p 39 gpio[3] rts_uart connect_usb i/o o low vddio2 general purpose i/o 3 uart request-to-send output usb soft connect 40 gpio[5] rxd_uart i/o i pull-up vddio2 general purpose i/o 5 uart receive input 41 gpio[4] txd_uart i/o i pull-up vddio2 general purpose i/o 4 uart transmit output 42 gpio[2] cts_uart led_usb clk_ext i/o i pull-up vddio2 general purpose i/o 2 uart clear-to-send input usb led 12mhz clock output 43 reset_n i i pull-up vddio2 reset input (active low) 44 vddiorf rf-bb interface supply voltage 45 tms_jtag i i pull-up vddio1 jtag test mode select 46 tdo_jtag o o 3-state vddio1 jtag test data output 47 tdi_jtag i i pull-up vddio1 jtag test data input 48 tck_jtag i i pull-up vddio1 jtag test clock table 1: pin description BGB203 ?continued pin nr. pin name i/o reset state supply domain description www. datasheet datasheet datasheet datasheet 4u 4u4u 4u .com
philips semiconductors BGB203 bluetooth radio module with baseband controller product shortform datasheet rev. 1.0 ? 2005 july 28 6 of 24 5. block diagram 5.1 full sip fig 2. block diagram BGB203. timer usb vanlo pcm gpio i 2 c bt core sys pll sys osc mod demod ram flash pat c h jtag etm bridge uart int arm7tdmi lna pa div 2 vco vco regulator cntl rf synth loop filter tx + filter rx balun + filter tx/rx switch balun band pass filter limiter ant gpios rc osc osc lpo www. datasheet datasheet datasheet datasheet 4u 4u4u 4u .com
philips semiconductors BGB203 bluetooth radio module with baseband controller product shortform datasheet rev. 1.0 ? 2005 july 28 7 of 24 6. limiting values 7. electrical characteristics table 2: limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter min max unit v ddrf rf supply voltage ? 0.5 +3.6 v v ddiorf rf bb interface supply voltage ? 0.5 +2.5 v v ddc / v ddio1 core & i/o 1 supply voltage ? 0.5 +2.5 v v ddio2 i/o 2 supply voltage ? 0.5 +4.6 v v ddc core supply voltage ? 0.5 +2.5 v v ddo / v dda oscillator & analog supply voltage ? 0.5 +2.5 v v piniox input voltage on any v ddiox pin with respect to v ss ? 0.5 v ddiox +0.5 v v pinio5v input voltage on 5v tolerant pins with respect to v ss ? 0.5 6.0 v i i input current through any pin (except supply pins) 1 ma t amb ambient temperature ? 30 +85 c t stg storage temperature ? 40 +125 c table 3: ac/dc characteristics symbol parameter conditions min typ max unit supplies v ddrf rf supply voltage 2.65 2.75 3.3 v v ddiorf rf bb interface supply voltage 1.65 1.8 1.95 v v ddc / v ddio1 core & i/o 1 supply voltage 1.65 1.8 1.95 v v ddc core supply voltage 1.65 1.8 1.95 v v ddio2 i/o 2 supply voltage 1.65 1.8 / 3.3 3.6 v v ddo / v dda oscillator & analog supply voltage 1.65 1.8 1.95 v digital ios at v ddio1 v ih high level input voltage 0.7 v ddio1 ? ? v v il low level input voltage ? ? 0.3 v ddio1 v v hyst hysteresis voltage 0.3 v ddio1 ? ? v v oh high level output voltage i oh = 4ma v ddio1 ? 0.4 ? ? v v ol low level output voltage i ol = 4ma ? ? 0.4 v www. datasheet datasheet datasheet datasheet 4u 4u4u 4u .com
philips semiconductors BGB203 bluetooth radio module with baseband controller product shortform datasheet rev. 1.0 ? 2005 july 28 8 of 24 [1] at room temperature [2] in link null sent digital ios at v ddio2 v ih high level input voltage 0.7 v ddio2 ? ? v v il low level input voltage ? ? 0.3 v ddio2 v v hyst hysteresis voltage 0.3 v ddio2 ? ? v v oh high level output voltage i oh = 4ma v ddio2 ? 0.4 ? ? v v ol low level output voltage i ol = 4ma ? ? 0.4 v power dissipation and current consumption [1] power system off oscillator is switched off ? 15 ? a active hv3 master [2] ? 42.88 ? mw baseband consumption all vdd=1.8v (except vddrf) 8.42 ma radio vddrf = 2.75v 10.08 ma active hv3 slave [2] ? 54.14 ? mw baseband consumption all vdd=1.8v (except vddrf) 8.78 ma radio vddrf = 2.75v 13.94 ma active ev5 master ? 31.5 ? mw baseband consumption all vdd=1.8v (except vddrf) 8.29 ma radio vddrf = 2.75v 6.03 ma active ev5 slave ? 45.58 ? mw baseband consumption all vdd=1.8v (except vddrf) 8.61 ma radio vddrf = 2.75v 10.94 ma acl sniff, t sniff = 1024 (1.28s) master ? 0.28 ? mw slave ? 0.51 ? mw active acl acl link master, vddrf=2.75v, other vdds =1.8v ? 14.17 ? mw active acl acl link slave, vddrf=2.75v, other vdds =1.8v ? 31.2 ? mw discoverable mode vddrf=2.75v, other vdds =1.8v ? 2.12 ? mw table 3: ac/dc characteristics ?continued symbol parameter conditions min typ max unit www. datasheet datasheet datasheet datasheet 4u 4u4u 4u .com
philips semiconductors BGB203 bluetooth radio module with baseband controller product shortform datasheet rev. 1.0 ? 2005 july 28 9 of 24 7.1 timing characteristics [1] 12 mhz crystal [2] 13 mhz crystal [3] from por trip level, the vdd has 700us to reach vdda/vdo min@1.65v without going back lower than the trip level. [4] at the start of a packet the supply current jumps from zero to a level as defined in chapter 19.3. the supply should recover quick enough to keep vddrf above 2.65v. 7.2 analog characteristics table 4: timing symbol parameter conditions min typ max unit t osc xtal start up time BGB203 630 [2] 682 [1] s t pll lock time pll BGB203 250 s t osc + t pll start up time with pll locked BGB203 880 [2] 932 [1] s t rst baseband reset delay ? 1024 cycles t rc_delay minimal rf reset delay 200 ns t long_reset typical long reset duration 7.37 10 s t vddx minimal vdd rise time [3] 700 s t regulator_respons respons time to vddrf supply [4] 20 s table 5: system and low power oscillators symbol parameter conditions min typ max unit system clock input fsys_xtal system oscillator input frequency 12 13 or 24 26 mhz vswing_sys voltage input swing slave mode [5] 300 1700 mvpp vdc_sys dc input level slave mode [1][4] 950 mv vdd_sys ih high level input voltage on xtal1_sys pin bypass mode 0.8vddo - vddo v vdd_sys il low level input voltage on xtal1_sys pin bypass mode 0 - 0.2vddo v ri_sys_xtal system oscillator input impedance slave mode [6] 63 kohm ci_sys_xtal system oscillator input capacitance to ground oscil. mode [2] 12 pf slave mode [6] 5 pf ci_tune_max system oscillator programmable capacitance to ground [3] 25 pf ci_steps tuning step size for programmable capacitance 0.1 pf gm_sys transconductance 21 40 ma/v rout_sys output impedance on xtal2_sys pin 900 ohm low power clock input flpo_xtal low power osc frequency oscil. mode 32.768 khz t start,avg lpo average start-up time oscil. mode 6 ms vswing_lpo low power input swing slave mode [7] 320 1800 mvpp vdc_lpo dc input level slave mode [7] 320 mv vdd_lpo ih high level input voltage on xtal1_lpo pin bypass mode 0.8vddo - vddo v www. datasheet datasheet datasheet datasheet 4u 4u4u 4u .com
philips semiconductors BGB203 bluetooth radio module with baseband controller product shortform datasheet rev. 1.0 ? 2005 july 28 10 of 24 [1] for lowest current consumption the input signal must be ac coupled with 100 pf and have a maximum input level of 1700 mv (p-p) [2] excluding on-chip tuning capacitance (rxtun set to 0x00). [3] typical value for full capacitance. the capacitor array has a tolerance of +/- 30%. [4] v swing_sys + 0.5v swing_sys(pp) must be lower than 1.3 v. when the input signal is ac coupled the dc input level is biased at 950 mv. [5] for input voltage below 400mv (p-p), an external 120kohms pull-up resistor between xtal1_sys pin and v ddio18 is required. [6] in slave mode, the input impedance of the system is modelled as a parallel resistor and capacitor to ground. [7] the capacitor for the ac coupling is already integrated in the sip. [1] vanlo pin configured as analog output. [2] vanlo pin configured as analog input. vdd_lpo il low level input voltage on xtal1_lpo pin bypass mode 0 - 0.2vddo v lpo_acc lpo rc clock accuracy calibrated 50 ppm v thl(por) lower power-on reset threshold voltage measured on pin vdda/ vddo - 1.0 - v v thu(por) upper power-on reset threshold voltage measured on pin vdda/ vddo - 1.4 - v table 5: system and low power oscillators ?continued symbol parameter conditions min typ max unit table 6: analog ai0 symbol parameter conditions min typ max unit vref voltage reference 1.4 v d/a converter vanlo dac output voltage [1] vss 1.4 v ianlo dac output current pull-up 120 150 a pull-down 3 ma dac resolution 8 bits ile dac integral linearity error -2 2 lsb dle dac differential linearity error -1 1 lsb a/d converter vin input voltage [2] vss 1.4 v rin input resistor 1 mohm radc adc input resistance 1 mohm res adc resolution 8 bit offset -1 +1 lsb ile integral linearity error -2 +2 lsb dle differential linearity error 0 +1 lsb www. datasheet datasheet datasheet datasheet 4u 4u4u 4u .com
philips semiconductors BGB203 bluetooth radio module with baseband controller product shortform datasheet rev. 1.0 ? 2005 july 28 11 of 24 7.3 radio characteristics table 7: analog bandgap symbol parameter conditions min typ max unit vbg bandgap voltage 1.15 1.21 1.25 v iddbg bandgap and abv buffer consumption to be measured on vdda 5 10 20 a iddbgoff bandgap and abv buffer consumption with buffer disabled to be measured on vdda - - 25 na tbgbuffer bandgap buffer start-up time 100 s table 8: radio [5] symbol parameter conditions min typ max unit power consumption i ddrf rf supply current rx guard space ? 18 ? ma rx (pll off) ? 33 46 ma tx guard space ? 18 ? ma tx (pll off) [4] ? 29 35 ma power-down mode ? 1 2.5 a frequency selection ? f1 slot carrier drift over 1 tx slot [2] -25 0 25 khz ? f3, 5 slots over 3, 5 tx slots (dm3, dh3, dm5, dh5 packets) [2] -40 0 40 khz icft initial carrier frequency tolerance [2] -75 0 75 khz transmitter performance f rf rf frequency over full temperature and supply range 2402 ? 2480 mhz p o output power max. pa_cntrl=7 nom. pa_cntrl=4 min. pa_cntrl=0 [2] 0 -5 ? +5.5 0 -11 +4 dbm dbm dbm step size [7] 3 dbm p o 1 mhz adjacent channel output power at 2 mhz offset [2] [3] at 3mhz offset and more [2] [3] -45 -50 -20 -40 dbm f dev frequency deviation 1111000 bit pattern [2] [3] 140 ? 175 khz bw 20db 20 db bandwidth [2] [3] ? 0.7 1 mhz vswr voltage standing wave ratio normalized to z 0 50 ? ? 2 ? www. datasheet datasheet datasheet datasheet 4u 4u4u 4u .com
philips semiconductors BGB203 bluetooth radio module with baseband controller product shortform datasheet rev. 1.0 ? 2005 july 28 12 of 24 [1] the actual vco frequency is twice the programmed frequency. it is divided by 2 internally. [2] over full temperature and supply voltage range. [3] bluetooth test specification: rf, 2004-11-4, rf.ts/2.0.e.2 [4] pa_cntrl = 0x04 [5] according to 1.2 bluetooth specification. [6] measured in 100khz bandwidth. referred to wanted channel. [7] pa_cntrl <= 0x05 spurious out of band spurious emissions (conducted) 30 mhz to 1 ghz [2] - ? 36 dbm 1 ghz to 12.75 ghz [2] - ? 30 dbm 1.8 ghz to 1.9 ghz [2] - ? 47 dbm 5.15 ghz to 5.3 ghz [2] - ? 47 dbm receiver performance sens sensitivity for ber = 0.1 % without carrier offset / hopping off -76 ? 88 ? dbm with dirty transmitter as specified in note 3 [2] -76 -80 ? dbm sensitivity for per = 0.5 % without carrier offset / hopping off -76 -80 ? dbm p i max maximum input power in one channel ber < 0.1 % [2] -20 -10 ? dbm vswr voltage standing wave ratio normalized to z o =50 - 1.5 ? f rf rf input frequency [2] 2402 - 2481 mhz c/ i co-channel +11 +9.5 dbc n+/-1 0 -10 dbc n-2 -30 -38 dbc n+2 -9 -30 ? dbc n+3 -20 -45 ? dbc n-3 and lower , n+4 and beyond ?40 -48 ? dbc obb out of band blocking table 8: radio [5] ?continued symbol parameter conditions min typ max unit www. datasheet datasheet datasheet datasheet 4u 4u4u 4u .com
philips semiconductors BGB203 bluetooth radio module with baseband controller product shortform datasheet rev. 1.0 ? 2005 july 28 13 of 24 8. esd precautions inputs and outputs are protected against electrostatic discharge (esd) during handling and mounting. a human-body model (hbm) and a machine model (mm) are used for esd susceptibility testing. all pins withstands the following threshold voltages: [1] for all pins except pin 2. [2] for pin 2. table 9: esd threshold voltages parameter method value class esd threshold voltage hbm (jesd22-a114-b) [1] 3500 (v) 2 mm (jesd22-a115-a) [1] 300 (v) 2 hbm (jesd22-a114-b) [2] 250 (v) 1a mm (jesd22-a115-a) [2] 200 (v) 2 www. datasheet datasheet datasheet datasheet 4u 4u4u 4u .com
philips semiconductors BGB203 bluetooth radio module with baseband controller product shortform datasheet rev. 1.0 ? 2005 july 28 14 of 24 9. thermal characteristics table 10: esd threshold voltages parameter method value unit r th j-a thermal resistance from junction to ambient 30 k/w www. datasheet datasheet datasheet datasheet 4u 4u4u 4u .com
philips semiconductors BGB203 bluetooth radio module with baseband controller product shortform datasheet rev. 1.0 ? 2005 july 28 15 of 24 10. package outline fig 3. package outline. www. datasheet datasheet datasheet datasheet 4u 4u4u 4u .com
philips semiconductors BGB203 bluetooth radio module with baseband controller product shortform datasheet rev. 1.0 ? 2005 july 28 16 of 24 10.1 pcb footprint outline fig 4. pcb footprint outline, metal defined. 24 13 36 25 1 12 48 37 www. datasheet datasheet datasheet datasheet 4u 4u4u 4u .com
philips semiconductors BGB203 bluetooth radio module with baseband controller product shortform datasheet rev. 1.0 ? 2005 july 28 17 of 24 11. soldering 11.1 solder paste standard (no-clean) sn/pb (63%/37%) or pb-free solder pastes should be used for soldering the package. solder pastes should be selected based on their printing and reflow behavior. for pb-free solder paste it is recommended to use sac type solder paste (e.g. snag3.8cu0.7) with melting point of 217c. reflow profile industrial convection reflow oven should be used to mount the packages. the profile depends on the printed circuit board and other components that are used in the customer application. for maximum peak temperature jedec specification should be followed. www. datasheet datasheet datasheet datasheet 4u 4u4u 4u .com
philips semiconductors BGB203 bluetooth radio module with baseband controller product shortform datasheet rev. 1.0 ? 2005 july 28 18 of 24 fig 5. recommended reflow temperature profile. temperature time t p t l t s ts min 25 ts max preheat t l t 25c to peak ramp-up ramp-down critical zone t l to t p temperature time t p t l t s ts min 25 ts max preheat t l t 25c to peak ramp-up ramp-down critical zone t l to t p following reflow profile and constraints are recommended for eutectic sn/pb and pb-free reflow solders. eutectic sn/pb pb-free average ramp-up rate (ts max to tp) 2 c/second max. 2 c/second max * . preheat ? temperature min (ts min ) ? temperature max (ts max ) ? time (ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 75-90 seconds ( 0.75c/second ) time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-90 seconds 217 c 70-90 seconds max. peak temperaure (tp) 240 +0/-5 c 260 +0 c time within 5 c of actual peak temperature (t p ) 10-30 seconds 20-30 seconds ramp-down rate > 180 c: 2 c/second max. < 180 c: 6 c/second max. > 180 c: 2 c/second max * . < 180 c: 6 c/second max. minimum peak temperature (tp min ) 205 c 230 c time 25c to tptp tp tp tp 4-5 minutes 4-5 minutes *ramp-up and -down is lower than specified in jedec jstd-020c. www. datasheet datasheet datasheet datasheet 4u 4u4u 4u .com
philips semiconductors BGB203 bluetooth radio module with baseband controller product shortform datasheet rev. 1.0 ? 2005 july 28 19 of 24 11.2 moisture sensitivity level the following moisture sensitivity levels (msl) is applicable for sot863 hllga48 package. 11.3 rework if rework is needed, then the packages can be removed or reworked using a bga repair station. the rework process involves the following steps: 1) component removal 2) site redress 3) solder paste application, 4) component placement, and 5) component attachment. these steps are discussed the following in more detail 1) component removal the first step in removal of component is the reflow of solder joints. it is recommended to preheat the pcb to 150c using a bottom heater. heating of the top side of the component should be done using hot air while a special nozzle can be used for this purpose. excessive airflow should also be avoided since this may cause shifting of adjacent components. once the joints have reflowed, the vacuum lift-off can start. because of their small size the vacuum pressure should be kept below 15 inch of hg. this will prevent damage to the pcb solderland (pad lift). the temperature of the package should not exceed 260 c during this rework process since damage can occur to either the package or the pcb. the temperature profile depends on the customer application. 2) site redress after the component is removed, the pcb solderland needs to be cleaned properly. it is best to use a combination of a blade-style conductive tool and desoldering braid. the width of he blade should be matched to the maximum width of the footprint and the blade temperature should be low enough not to cause any damage to the circuit board. flux residues on the pcb can be removed using isopropyl alcohol (ipa). 3) solder paste application maximum peak temperature (tmax) msl 240c msl3 250c msl3 260c msl3 www. datasheet datasheet datasheet datasheet 4u 4u4u 4u .com
philips semiconductors BGB203 bluetooth radio module with baseband controller product shortform datasheet rev. 1.0 ? 2005 july 28 20 of 24 it is recommended to re-apply solder by dispensing or stencil printing. the amount of solder applied on the terminals should be in the order of 0.08 mg. in case of dispensing, a gage 27 (0.2 mm opening) needle (e.g. white efd needle) should be used with 0.3s-0.4s shot at 4 bar. for stencil printing a mini stencil of 0.1 mm thickness can be used if application allows room for it. 4) a bga repair station has a vacuum pick up tool and usually some component alignment possibilities.a split-beam optical system should be used to align the component on the solder lands. this will form an image of leads overlaid on the mating footprint and aid in proper alignment. the placement machine should have the capability of allowing fine adjustments in x, y, and rotational axes. manual placement is not recommended, although the package allows 0.1-0.15 mm misplacement. 5) for re-soldering of the newly placed component the same profile of bottom and top heating should be applied as described in the step 1). the moisture sensitivity levels are determined following jedec jstd-020c. the datasheet of the device states the actual msl witch might deviate from this guideline. www. datasheet datasheet datasheet datasheet 4u 4u4u 4u .com
philips semiconductors BGB203 bluetooth radio module with baseband controller product shortform datasheet rev. 1.0 ? 2005 july 28 21 of 24 12. packing BGB203 is available in tape & reel with standard packing quantity (pqp) of 2500 pcs. BGB203 packing is in drypack format since the component has msl3, which gives it a floorlife of 72hrs outside drypack. www. datasheet datasheet datasheet datasheet 4u 4u4u 4u .com
philips semiconductors BGB203 bluetooth radio module with baseband controller product shortform datasheet rev. 1.0 ? 2005 july 28 22 of 24 13. revision history 14. trademarks goodlink is a trademark of koninklijke philips electronics n.v. bluetooth ---- a trademark of sig 15. ordering information 16. data sheet status notes please consult the most recently issued data sheet before initiating or completing a design. the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the latest information is available on the internet at url http://www.semiconductors.philips.com. definitions short-form specification : the data in a short-form specification is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. table 11: revision history rev date cpcn description 1.0 20050728 product shortform datasheet table 12: ordering information type number package name description version BGB203/1 sot 863-1 bluetooth radio module with baseband controler; 12 nc: 9340 592 93518 s01 data sheet status product status definitions objective data development this data sheet contains data from the objective specification for product development. philips semiconductors reserves the right to change the specification in any manner without notice. preliminary data qualification this data sheet contains data from the preliminary specification. supplementary data will be published at a later date. philips semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. product data production this data sheet contains data from the product specification. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. changes will be communicated according to the customer product/process change notification (cpcn) procedure snw-sq-650a. www. datasheet datasheet datasheet datasheet 4u 4u4u 4u .com
philips semiconductors BGB203 bluetooth radio module with baseband controller product shortform datasheet rev. 1.0 ? 2005 july 28 23 of 24 limiting values definition : limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the specification is not implied. exposure to limiting values for extended periods may affect device reliability. application information : applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. disclaimers life support applications : these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes : philips semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. www. datasheet datasheet datasheet datasheet 4u 4u4u 4u .com
philips semiconductors BGB203 bluetooth radio module with baseband controller product shortform datasheet rev. 1.0 ? 2005 july 28 24 of 24 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.1 general. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2 radio hardware . . . . . . . . . . . . . . . . . . . . . . . . 2 2.3 baseband hardware . . . . . . . . . . . . . . . . . . . . . 2 2.3.1 hardware features . . . . . . . . . . . . . . . . . . . . . . 2 2.3.2 firmware features. . . . . . . . . . . . . . . . . . . . . . . 3 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 4 pinning information . . . . . . . . . . . . . . . . . . . . . . 4 4.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 4.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 5 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 6 5.1 full sip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7 7 electrical characteristics . . . . . . . . . . . . . . . . . 7 7.1 timing characteristics. . . . . . . . . . . . . . . . . . . . 9 7.2 analog characteristics . . . . . . . . . . . . . . . . . . . 9 7.3 radio characteristics . . . . . . . . . . . . . . . . . . . 11 8 esd precautions . . . . . . . . . . . . . . . . . . . . . . . 13 9 thermal characteristics. . . . . . . . . . . . . . . . . . 14 10 package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 10.1 pcb footprint outline. . . . . . . . . . . . . . . . . . . . 16 11 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 12 packing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 13 revision history. . . . . . . . . . . . . . . . . . . . . . . . 22 14 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 15 ordering information . . . . . . . . . . . . . . . . . . . . 22 16 data sheet status . . . . . . . . . . . . . . . . . . . . . . . 22 www. datasheet datasheet datasheet datasheet 4u 4u4u 4u .com

▲Up To Search▲

Price & Availability of BGB203

	To Download BGB203 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .